Migration effects at conductor / XLPE interface subjected to partial discharges at different electrical stresses
PBN-AR
Instytucja
Wydział Elektrotechniki, Automatyki, Informatyki i Inżynierii Biomedycznej (Akademia Górniczo-Hutnicza im. Stanisława Staszica w Krakowie)
Książka
Tytuł książki
CEIDP. 2013 annual report conference on Electrical Insulation and Dielectric Phenomena : October 20–23, 2013, Shenzhen, China
Data publikacji
2013
ISBN
978-1-4799-2596-4
Wydawca
Institute of Electrical and Electronics Engineers, Inc.
Publikacja
Główny język publikacji
EN
Tytuł rozdziału
Migration effects at conductor / XLPE interface subjected to partial discharges at different electrical stresses
Rok publikacji
2013
Strony (od-do)
1189--1192
Numer rozdziału
Identyfikator DOI
Liczba arkuszy
0.28
Hasło encyklopedyczne
Autorzy
Pozostali autorzy
+ 2
Konferencja
Indeksowana w Scopus
tak
Indeksowana w Web of Science Core Collection
tak
Liczba cytowań z Web of Science Core Collection
Nazwa konferencji (skrócona)
CEIDP
Nazwa konferencji
IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena
Początek konferencji
2013-10-20
Koniec konferencji
2013-10-23
Lokalizacja konferencji
Shenzhen
Kraj konferencji
CN
Lista innych baz czasopism i abstraktów w których była indeksowana
INSPEC
Streszczenia
Język
EN
Treść
Migration effects occurring at conductor/XLPE interface are presented in the paper. The phenomenon was studied under various electrical stresses: direct current (DC), pulse-width modulated (PWM) and sinusoidal (SIN). The comparison of aging effects on specimens subjected to the stimuli was presented. The electrical stress results in partial discharges, both around the electrode in the form of surface discharges and directly at the micro air gap interface between conductor and polymeric material. In order to isolate the impact of interface discharges, the surface effects were suppressed, eliminated and compared with results containing both forms of discharges. The electrical and thermal mechanism was investigated in the paper and assessment was performed by means of time to breakdown and both micro morphological and elemental analysis. Migration of the conductor, where metallic particles are transferred to the insulating medium, was observed. Primarily, attention was afforded to the migration of copper and aluminum electrode atoms in two zones; one zone being the direct contact area at the interface and the second zone incorporating the area surrounding the electrode which is enhanced by surface discharges. A novel aspect relates to the investigation of the migration depth profile and the concentration intensity at different voltage stresses. The transport phenomena were analyzed with respect to both electrical and thermal mechanisms.
Cechy publikacji
chapter-in-a-book
peer-reviewed
Inne
System-identifier
idp:079760